Heat build-up in electronic components and other devices that produce unwanted heat can severely limit the service life and reduce the operating efficacy of those components.
Polymers have many advantages over commonly used metal or ceramic materials, including light-weighting, anti-corrosion and improved processability. However, the low thermal conductivity of polymers has limited their application.
To address this problem, Colloids have produced the H-TEC® range of thermally conductive compounds, enabling our customers to combine the advantages of polymers with thermally conductive filler components.
H-TEC® compounds have additional benefits in that they can reduce moulding cycle times. Their inherently low coefficient of thermal expansion lowers mould shrinkage, helping to replace metals and ceramics in dimensionally critical parts.
Please contact Colloids for more information on our H-TEC® range of thermally conductive compounds.