Conductive Compounds

Electrical compounds (E-TEC®) range – for applications where varying degrees of permanent electrical conductivity are required. Available as standard in PS, PC/ABS, PP, PA and PE (for film to 75 micron).

Four standard E-TEC® grades are available for rigid plastic containers and flexible sheet or film packaging, higher service temperature applications and where tougher, higher impact performance is required.

Features & Benefits

• A range of surface resistivity and polymer processing grade options
• Guaranteed conductive performance carbon black based bespoke E-TEC® formulations
• Enhanced static dissipation and electrical conductive performance
• Superior mechanical properties
• Enhanced process capability
• Excellent weldability and aesthetics

Thermal compounds (H-TEC®) range – developed to offer design engineers alternative material solutions to metals or ceramics by overcoming the low thermal conductivity of polymers, using thermally conductive filler components in compound formulations.

Features & Benefits

• Custom formulated H-TEC® compounds to meet specific application needs
• Enables designers to specify a lightweight, non-corrosive, plastic component
• Inherent low thermal expansion coefficient lowers moulded part shrinkage
• Overcomes heat build-up in electrical components
• Can reduce mould cycle times and improve processability
• Increases service life and improves part efficacy in use